TTIHP26b shuttle closed with 123 designs
Chips expected June 2027, shipping August 2027.
Tiny Tapeout Team
•21 September 2026
Chip Render - Logic Density
That’s wrap! We closed TTIHP26b yesterday. 123 projects submitted to the IHP-2609 shuttle, heading to manufacturing on the 0.13μm process.
Chips are expected on June 25, 2027, with estimated shipping on August 16, 2027.
Here are some of the designs:
Leo and the Fabulous team built a full FPGA on a single Tiny Tapeout tile, the Tiny FABulous FPGA. Then we have Preinception, a simple compute accelerator, connected via USB and driven with a C++ API and code on the host PC. There’s also a Scalable Banked L1 Memory Fabric purpose-built for edge AI.
On the analog side, we’ve got IEEE Bandgap References, LDO regulators, SAR ADC controllers, and a laser gyro readout core!.
Check out all the designs here!
Interested in submitting a design?
Here’s a list of future shuttles and how you can submit your design.
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Last modified by Matt Venn on 3 October 2026. Commit 3b70330. Suggestions?